Engineered with proprietary polymer-modification expertise, our thermal interface materials deliver high conductivity and exceptional conformability for even the most demanding heat-management designs. Leveraging a dry-process polymer modification (polymer compounding) approach, Jiujutech pads achieve up to 30% better thermal performance than conventional formulations. Samples and full thermal design support are available.
Features: Durable, electrically insulating silicone pads for stable long-term cooling.
Thermal Conductivity: 0.8–6.0 W/m·K (customizable)
Applications: Notebooks, power modules, telecom hardware
Customization: Adhesive/non-adhesive, die-cut shapes, 0.2–5 mm thickness
Features: Extremely soft and conformable pads that fill surface irregularities with ease.
Thermal Conductivity: 0.8–5.0 W/m·K
Applications: Smartphones, VR modules, DRAM/VRAM cooling
Features: High conductivity, low thermal resistance pads for dense power devices.
Thermal Conductivity: 2.0–15.0 W/m·K
Applications: GPUs, OBC, power electronics, industrial controllers
Features: Low oil-bleed formulation for clean, stable, long-term performance.
Thermal Conductivity: 0.8–6.0 W/m·K
Applications: Precision optics, medical electronics, long-life boards
Features: Solid at room temp, flowable at heat — ultra-low interface resistance.
Thermal Conductivity: 2.0–8.0 W/m·K (effective conductivity improves post-phase change)
Applications: High-performance modules, heatsink interfaces
Features: Oil-free, clean pads for silicone-sensitive precision devices.
Conductivity: 1.0–12.0 W/m·K
Applications: Optics, LEDs, medical equipment
Outstanding thermal conductive materials address your issues.
We produce adhesives and thermally conductive materials for industries like automotive, new energy, electronics, medical, and aerospace.
Polymer modification expertise for balanced conductivity + flexibility
ISO9001 / ISO14001 / UL / IATF / High-Tech Enterprise
Factory-level testing, aging & thermal cycling, 5-year warranty
we show our products and technologies to the world, and at the same time provide a convenient channel for our customers to understand and purchase our products.
Our thermal pads are developed using advanced polymer thermal material modification technology, enabling higher thermal conductivity, improved mechanical resilience, and tailored performance for demanding energy storage and EV applications.
Proprietary Polymer-Modification Technology — Our dry-process compounding enhances filler-matrix bonding, boosting thermal conductivity without sacrificing pad softness
Tailored Performance — We custom-engineer hardness, elasticity, and thermal properties for specific EV, energy-storage, or electronic applications. Products can be fine-tuned in thickness, geometry, adhesive, and formulation.
Durability & Stability — Polymer-engineered pads resist thermal cycling, mechanical vibration, and aging. They maintain conductivity and compliance after thousands of hours at temperature, ensuring device longevity.
Discover what our clients have to say
Select thickness based on gap (0.2, 0.5, 1.0 mm common) and conductivity based on heat flux. Smartphones often use 0.8–5 W/m·K, high-power modules ≥6 W/m·K.
Yes — most silicone and non-silicone grades are dielectric. Always confirm breakdown voltage specs for your model.
Pads are clean, automatable, and consistent for fixed gaps. Pastes can be thinner and more conductive but are messy and less scalable.
Yes — thickness, hardness, adhesives, and conductivity can be customized. Samples available on request.
