Thermal Interface Pads for Power Modules, Battery Packs & Industrial Electronics
Excellent gap conformity, consistent thermal conductivity, electrical insulation, long-term reliability under thermal cycling.
Features: Durable, electrically insulating silicone pads for stable long-term cooling.
Thermal Conductivity: 0.8–6.0 W/m·K (customizable)
Applications: Notebooks, power modules, telecom hardware
Customization: Adhesive/non-adhesive, die-cut shapes, 0.2–5 mm thickness
Features: Extremely soft and conformable pads that fill surface irregularities with ease.
Thermal Conductivity: 0.8–5.0 W/m·K
Applications: Smartphones, VR modules, DRAM/VRAM cooling
Features: High conductivity, low thermal resistance pads for dense power devices.
Thermal Conductivity: 2.0–15.0 W/m·K
Applications: GPUs, OBC, power electronics, industrial controllers
Features: Low oil-bleed formulation for clean, stable, long-term performance.
Thermal Conductivity: 0.8–6.0 W/m·K
Applications: Precision optics, medical electronics, long-life boards
Features: Solid at room temp, flowable at heat — ultra-low interface resistance.
Thermal Conductivity: 2.0–8.0 W/m·K (effective conductivity improves post-phase change)
Applications: High-performance modules, heatsink interfaces
Features: Oil-free, clean pads for silicone-sensitive precision devices.
Conductivity: 1.0–12.0 W/m·K
Applications: Optics, LEDs, medical equipment
R&D driven. Quality focused. Performance guaranteed.
We produce thermally conductive materials for industries like automotive, new energy, electronics, medical, and aerospace.
Polymer modification expertise for balanced conductivity + flexibility
ISO9001 / ISO14001 / UL / IATF / High-Tech Enterprise
Factory-level testing, aging & thermal cycling, 5-year warranty
Eliminate the mess of grease. Our naturally tacky pads bond instantly to heat sinks, streamlining your production line while ensuring consistent thermal performance.
Our comprehensive service model is designed to support your project from initial design to mass production, ensuring you achieve maximum performance and stability for your electronics.
Custom Material Matchmaking
Predictive Performance Modeling
Dedicated Engineering Guidance
Discover what our clients have to say
Select thickness based on gap (0.2, 0.5, 1.0 mm common) and conductivity based on heat flux. Smartphones often use 0.8–5 W/m·K, high-power modules ≥6 W/m·K.
Yes — most silicone and non-silicone grades are dielectric. Always confirm breakdown voltage specs for your model.
Pads are clean, automatable, and consistent for fixed gaps. Pastes can be thinner and more conductive but are messy and less scalable.
Yes — thickness, hardness, adhesives, and conductivity can be customized. Samples available on request.
