Flight Control & Mission Payload
Ensure stable processing. High-performance TIMs prevent thermal throttling in flight controllers, main processors, and communication modules, guaranteeing system accuracy and reliability
Industry Pain Points
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High Power Density: Flight controllers and power modules generate intense heat in compact layouts.
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Limited Cooling Airflow: Restricted airflow at low speeds reduces heat dissipation efficiency.
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Weight Constraints: Traditional cooling solutions add unwanted weight and reduce flight time.
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Read more >>Power & Electrical Systems
Protect power circuits. Thermal solutions dissipate heat from high-current components like ESCs and power management units, preventing overheating and component failure.
Read more >>Energy Storage System
Enhance battery safety and life. Flame-retardant thermal materials manage heat within battery packs, promoting temperature uniformity to prevent thermal runaway and extend service life.
Read more >>Precision Sensors
Maintain measuring accuracy. Thermal control stabilizes the operating temperature of sensitive instruments like IMUs, cameras, and LiDAR, minimizing thermal drift and noise for reliable data acquisition.
Ultra-Light 1.0 W/m·K Thermal Pad – Gap Filling for Compact UAV Electronics
Property Value Thermal Conductivity 1.5 – 8.0 W/m·K Dielectric Breakdown Voltage > 6.0 – 10.0 kV/mm Hardness & Deflection 0.5–5 mm Shore 00 20 – 50 (High Compressibility) -50°C to +200°C | UL 94 V-0 Ideal EV Applications OBC, DC-DC, High-Voltage PDU, Battery Packs 
Low-Weight 3.0 W/m·K Thermal Gel – Vibration-Resistant Thermal Interface
Property Value Thermal Conductivity 2.0 – 6.5 W/m·K Dispensing Flow Rate High Thixotropic / >40 g/min Outgassing (Siloxane) Ultra-low Outgassing / Non-Silicone Available Operating Temp & Reliability -50°C to +180°C | Anti-Slumping Ideal EV Applications ADAS Cameras, LiDAR, ECUs, Sensor Modules 
High-Performance 4.0 W/m·K Thermal Paste – Efficient Cooling for Power-Dense Modules
Property Value Thermal Conductivity 3.0 – 6.5 W/m·K Thermal Impedance & BLT < 0.04 °C·in²/W | Min BLT ~15 µm Dielectric Breakdown Voltage > 4.0 – 8.0 kV/mm Operating Temp & Reliability -50°C to +180°C | Anti-Pump-Out (>1,000 hrs) Ideal EV Applications SiC/IGBT Power Inverters, MCU Chipsets, Fast Chargers
Customer Reviews
More in line with the academic scenarios
Optimize Your UAV’s Performance Today
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Lightweight Thermal Solutions: Optimized materials minimize added weight while maintaining thermal efficiency.
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Reliable Under Dynamic Conditions: Stable performance under vibration, shock, and rapid temperature changes.
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Compact Integration: Designed for tight layouts in flight control and power systems.
Excellent Thermal Conductivity
Help
Thermal pads, gap fillers, and gels are commonly used for UAV batteries, ESCs, motors, and flight-control electronics. The best choice depends on power density, available space, and required thermal conductivity.
Depending on the component and design, high-performance TIMs can reduce surface temperatures by 20–45%, improving stability and extending component life.
Yes. Our materials are designed with low density to minimize added weight while still delivering strong heat-transfer efficiency—ideal for compact or long-endurance UAVs.
Absolutely. They maintain stable performance across –40°C to +150°C, supporting UAV operation under high temperature, humidity, or vibration conditions.
