Smartphone Thermal Management
Ultra-thin grades engineered for tight z-height and high power density.
Industry Pain Points
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High Heat Density: Compact devices generate excessive heat, risking performance throttling.
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Limited Space: Slim designs leave little room for traditional cooling solutions.
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Long-Term Reliability: Repeated thermal cycles degrade conventional pads and pastes.
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Read more >>Laptop and Tablet Cooling
High-conductivity pads that route heat to chassis and heat spreaders to reduce fan duty cycles, lower noise, and extend battery life — with formulations optimized for long-term mechanical stability under thermal cycling.
Read more >>Gaming Console Heat Dissipation
High-performance, compressible pads for large power spikes and localized hotspots. Formulations prioritize thermal conductivity and resilient compression set for steady performance during long play sessions.
Read more >>Smart Home Device Cooling
Soft, electrically insulating pads that provide reliable thermal contact in small enclosures — ideal for hubs, routers, and IoT modules where space and safety matter.
Read more >>Wearable Device Thermal Control
Lightweight, flexible materials that balance thermal spread with tactile comfort — designed for low-profile assemblies and strict weight limits.
Ultra-Soft 1.0 W/m·K Thermal Pad – Conformal Gap Filling for Compact Devices
Property Value Thermal Conductivity 1.0-30.0W/m·K Hardness 35 Shore 00 Thickness 0.5–5 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0 
Cost-Effective 2.5 W/m·K Thermal Gel – Automated Application for Thin Electronics
Property Value Thermal Conductivity 1.0-16.0 W/m·K Hardness 30 ± 5 Shore 00 Thickness 0.3 – 2.0 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0 
High-Performance 4.0 W/m·K Thermal Paste – Low Thermal Resistance for CPUs and GPUs
Property Value Thermal Conductivity 10.0-20.0W/m·K Thickness 0.05 – 0.5 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0
Customer Reviews
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Why Choose JiuJu
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Designed for Compact Electronics: Materials optimized for thin, lightweight, and high-power consumer devices.
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Stable Thermal Performance: Reliable heat dissipation reduces throttling and supports long device lifetime.
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Manufacturing Friendly: Consistent quality supports high-volume, automated electronics production.
Excellent Thermal Conductivity
Help
Thermal pads fill microscopic air gaps and provide a reliable, clean thermal path from ICs and batteries to spreaders or housings — essential for temperature control and device longevity.
Smartphones, laptops, tablets, consoles, smart home devices, and wearables — anywhere thin profile and predictable assembly are priorities.
Pads are cleaner, easier to automate, and suited to mass production and fixed gaps. Pastes can offer slightly higher contact at very thin gaps but are messier and harder to control in high-volume lines.
Yes — conductivity, thickness, hardness, and adhesives can be tailored for your assembly and thermal target.
