The Silicone Thermal Pad is a high-performance thermal interface material (TIM) designed to efficiently transfer heat between electronic components and heat sinks or housings. Made from flexible, electrically insulating silicone rubber filled with thermally conductive particles, it ensures excellent heat dissipation and long-term reliability under varying thermal and mechanical stresses.
These are the specifications for our standard thermal pad products. For materials with thermal conductivity above 10 W/m·K, please contact our sales team directly — our technical manager will provide dedicated support and customized solutions.
| Attributes | JIUJU-6200 | JIUJU-6300 | JIUJU-600SS | JIUJU-6300LV | JIUJU-6450 | JIUJU-6500 | JIUJU-6500SS | JIUJU-6600 | JIUJU-6600LV | Testing Standards |
|---|---|---|---|---|---|---|---|---|---|---|
| Colour | Grey | Green | Yellow | White | Light Yellow | Blue | Grey | Dark Grey | Dark Grey | Visual Inspection |
| Thickness(mm) | 0.3~5.0 | 0.3~5.0 | 0.3~5.0 | 0.3~5.0 | 0.3~5.0 | 0.3~5.0 | 0.3~5.0 | 0.5~5.0 | 0.5~5.0 | ASTM D374 |
| Density(g/cc) | 2.3 | 2.9 | 3.1 | 3.1 | 3.1 | 3.4 | 3.1 | 3.4 | 3.4 | ASTM D792 |
| Hardness(Shore OO) | 50 | 50 | 25 | 40 | 50 | 50 | 25 | 40 | 50 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 |
| Thermal Conductivity(W/m.k) | 2.0 | 3.0 | 3.0 | 3.0 | 4.5 | 5.0 | 5.0 | 6.0 | 6.0 | ASTM D5470 |
| Thermal Resistance(℃/W) | 0.95 | 0.5 | 0.48 | 0.53 | 0.28 | 0.26 | 0.23 | 0.22 | 0.28 | ASTM D5470 |
| Breakdown Voltage | >6 | >6 | >6 | >6 | >6 | >6 | >6 | >6 | >6 | ASTM D149 |
| Volume Resistivity(ohm-cm) | 1.0*10^13 | 1.0*10^14 | 1.2*10^14 | 1.0*10^14 | 3.0*10^15 | 3.0*10^15 | 3.0*10^15 | 3.0*10^15 | 3.0*10^15 | ASTM D257 |
| Dielectric Constant | 5.5 | 5.5 | 5.5 | 5.7 | 5.7 | 7.9 | 8.0 | 8.1 | 8.1 | ASTM D150 |
| Flame Retardant Grade | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | UL94 |
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