High-Density CPU & GPU Hotspots
Modern CPUs and GPUs generate extreme heat under continuous workloads. Efficient thermal interfaces help maintain stable performance and prevent thermal throttling in high-density server environments.
Industry Pain Points
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Extreme Heat Load: CPUs, GPUs, and accelerators produce continuous high thermal output.
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Uptime Requirements: Thermal failures directly impact system stability and service availability.
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Long-Term Degradation: Prolonged high temperatures accelerate TIM aging and performance loss.
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Read more >>Power Conversion Heat Control
Power supply units and power stages operate continuously at high load. Reliable thermal solutions help control component temperatures and support long-term system stability.
Read more >>Memory and VRM Thermal Stability
Memory modules and VRMs experience sustained thermal stress in compact server layouts. Proper heat dissipation reduces performance degradation and improves overall system reliability.
Read more >>Storage and Accelerator Cooling
SSDs and accelerator cards generate localized heat during intensive data processing. Effective thermal materials help manage heat buildup and support consistent system performance.
Ultra-Soft 1.0 W/m·K Thermal Pad – Tolerance Compensation for Server Assemblies
Property Value Thermal Conductivity 1.0-30.0W/m·K Hardness 35 Shore 00 Thickness 0.5–5 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0 
Cost-Effective 3.0 W/m·K Thermal Gel – Stable Application for High-Volume Production
Property Value Thermal Conductivity 1.0-16.0 W/m·K Hardness 30 ± 5 Shore 00 Thickness 0.3 – 2.0 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0 
High-Performance 5.0 W/m·K Thermal Paste – Long-Term Stability for 24/7 Operation
Property Value Thermal Conductivity 10.0-20.0W/m·K Thickness 0.05 – 0.5 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0
Customer Reviews
More in line with the academic scenarios
Unmatched Thermal Performance & Reliability
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High Thermal Efficiency: Supports effective cooling for CPUs, GPUs, and high-density server architectures.
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Built for 24/7 Operation: Materials maintain performance under continuous high thermal load.
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Production-Proven: Trusted in high-volume server manufacturing and data center deployments.
Excellent Thermal Conductivity
Help
For cleaner installation, reliable electrical insulation, and consistent long-term performance without drying or pumping out.
It depends on your component gap and heatsink pressure. Softer pads suit uneven surfaces; firmer ones work under high pressure.
Yes. They’re made to resist drying, oil bleeding, and degradation—even under continuous thermal cycling.
By keeping cell temperatures uniform and below critical thresholds, thermal pads reduce degradation rates, prevent thermal runaway, and can extend cycle life by up to 25 %, all while enhancing overall pack reliability.
