AI Accelerators & GPUs
High-performance AI chips operate at sustained peak power. Efficient thermal interfaces are critical to transfer heat to heat sinks and cold plates, preventing throttling and performance loss.
Industry Pain Points
-
Extreme Heat Density: AI accelerators and GPUs generate intense heat under continuous workloads.
-
System Throttling Risks: Inadequate thermal transfer limits sustained AI performance.
-
Reliability Under 24/7 Load: Long-term thermal stress accelerates material degradation.
- Read more >>
Read more >>AI Servers & Compute Nodes
Dense AI server architectures leave little margin for thermal inefficiency. Reliable thermal materials help maintain stable temperatures across CPUs, GPUs, and interconnect modules.
Read more >>High-Speed Memory & Interconnects
HBM, DDR, and high-speed interconnect components generate localized heat. Proper thermal management improves signal stability and system reliability.
Read more >>Power Delivery & Voltage Regulation
Power modules and VRMs supporting AI workloads operate continuously at high load. Stable thermal interfaces reduce thermal stress and extend component lifetime.
Ultra-Soft 1.5 W/m·K Thermal Pad – Gap Compensation for AI Modules and Assemblies
Property Value Thermal Conductivity 1.5 – 8.0 W/m·K Dielectric Breakdown Voltage > 6.0 – 10.0 kV/mm Hardness & Deflection 0.5–5 mm Shore 00 20 – 50 (High Compressibility) -50°C to +200°C | UL 94 V-0 Ideal EV Applications OBC, DC-DC, High-Voltage PDU, Battery Packs 
High-Conductivity 3.0 W/m·K Thermal Gel – Uniform Heat Transfer for Dense AI Systems
Property Value Thermal Conductivity 2.0 – 6.5 W/m·K Dispensing Flow Rate High Thixotropic / >40 g/min Outgassing (Siloxane) Ultra-low Outgassing / Non-Silicone Available Operating Temp & Reliability -50°C to +180°C | Anti-Slumping Ideal EV Applications ADAS Cameras, LiDAR, ECUs, Sensor Modules 
High-Performance 5.0 W/m·K Thermal Paste – Low Thermal Resistance for AI Processors
Property Value Thermal Conductivity 3.0 – 6.5 W/m·K Thermal Impedance & BLT < 0.04 °C·in²/W | Min BLT ~15 µm Dielectric Breakdown Voltage > 4.0 – 8.0 kV/mm Operating Temp & Reliability -50°C to +180°C | Anti-Pump-Out (>1,000 hrs) Ideal EV Applications SiC/IGBT Power Inverters, MCU Chipsets, Fast Chargers
Customer Reviews
More in line with the academic scenarios
Why Choose JiuJu
Extend Battery Cycle Life by up to 25 %: Better heat removal means less stress on cells. Reduce System Weight & Complexity: Thin pads replace bulky cooling assemblies.
Help
AI processors and accelerators operate at very high power density. Effective thermal management ensures stable performance, prevents throttling, and protects long-term hardware reliability.
Common solutions include thermal pads for gap filling, thermal gels for uniform interfaces in dense systems, and thermal pastes for direct contact with AI processors.
High-quality thermal materials reduce thermal resistance, enabling sustained clock speeds and consistent AI inference and training performance.
