AI Accelerators & GPUs
High-performance AI chips operate at sustained peak power. Efficient thermal interfaces are critical to transfer heat to heat sinks and cold plates, preventing throttling and performance loss.
Industry Pain Points
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Extreme Heat Density: AI accelerators and GPUs generate intense heat under continuous workloads.
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System Throttling Risks: Inadequate thermal transfer limits sustained AI performance.
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Reliability Under 24/7 Load: Long-term thermal stress accelerates material degradation.
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Read more >>AI Servers & Compute Nodes
Dense AI server architectures leave little margin for thermal inefficiency. Reliable thermal materials help maintain stable temperatures across CPUs, GPUs, and interconnect modules.
Read more >>High-Speed Memory & Interconnects
HBM, DDR, and high-speed interconnect components generate localized heat. Proper thermal management improves signal stability and system reliability.
Read more >>Power Delivery & Voltage Regulation
Power modules and VRMs supporting AI workloads operate continuously at high load. Stable thermal interfaces reduce thermal stress and extend component lifetime.
Ultra-Soft 1.5 W/m·K Thermal Pad – Gap Compensation for AI Modules and Assemblies
Property Value Thermal Conductivity 1.0-30.0W/m·K Hardness 35 Shore 00 Thickness 0.5–5 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0 
High-Conductivity 3.0 W/m·K Thermal Gel – Uniform Heat Transfer for Dense AI Systems
Property Value Thermal Conductivity 1.0-16.0 W/m·K Hardness 30 ± 5 Shore 00 Thickness 0.3 – 2.0 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0 
High-Performance 5.0 W/m·K Thermal Paste – Low Thermal Resistance for AI Processors
Property Value Thermal Conductivity 10.0-20.0W/m·K Thickness 0.05 – 0.5 mm Operating Temp –40 °C to 150 °C Flammability UL94 V-0
Customer Reviews
More in line with the academic scenarios
Why Choose JiuJu
Extend Battery Cycle Life by up to 25 %: Better heat removal means less stress on cells. Reduce System Weight & Complexity: Thin pads replace bulky cooling assemblies.
Help
AI processors and accelerators operate at very high power density. Effective thermal management ensures stable performance, prevents throttling, and protects long-term hardware reliability.
Common solutions include thermal pads for gap filling, thermal gels for uniform interfaces in dense systems, and thermal pastes for direct contact with AI processors.
High-quality thermal materials reduce thermal resistance, enabling sustained clock speeds and consistent AI inference and training performance.
