“Installation became much easier and cooling performance improved immediately.”
David MElectronics Manufacturer
Thermal Interface Materials Engineered for Power Electronics Up to 30 W/m·K
- IATF 16949 · ISO 9001 · ISO 1400
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UL · RoHS · REACH · Low Volatility (TML < 0.1 %)
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Thermal Pad 1.2–30 W/m·K · Thermal Gel 2.0–15 W/m·K (ASTM D5470)
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Custom Die-Cutting Pads · Putty · Free Samples · Ships in 48 Hours
Industrial Thermal Interface Materials | 1.2 to 30 W/m·K (ASTM D5470)
Silicone / Silicone-Free / EMC Absorbing Solutions
Unsure of the right grade for your design? Claim free 48-hour expert material selection customized to your thermal and assembly requirements.
Energy Storage
Prevent thermal runaway and keep cell ΔT ≤ 3°C with JIUJU TIMs.
• Specs: 2.0-8.0 W/m·K | UL94 V-0 | >8kV Dielectric
• Gap Pads: Precise thickness & reworkable.
• Thermal Gels: Conformable & excellent thixotropy.
New Energy Vehicles
Engineered to prevent insulation breakdown and thermal degradation in EV powertrains.
• SiC/IGBT Protection: >8kV Dielectric Strength
• Full-Range Specs: 2.0 – 8.0 W/m·K
• Audit-Ready: UL94 V-0 & IATF 16949 Certified
ADAS
High-performance thermal management for flagship SOCs, engineered to prevent thermal throttling and board contamination.
• Thermal Conductivity: 10 W/m·K with Phase Change Material (PCM)
• Reliability: No slip at 3mm | Zero slump after 1,000hrs @150°C
• Clean Operation: Ultra-low oil bleeding (<0.7% wt)
Consumer Electronics
Eliminate Throttling. Optimize Assembly.
• 2.0–11.0 W/m·K thermal conductivity for compact devices
• Single-sided tack for automated assembly & easy rework
• UL94 V-0 & >8kV reliable insulation & component safety
Optical Modules
Protect Sensitive Optics. Prevent Outgassing.
• 98–99.7% Non-volatile: High stability, zero optical contamination
• 3.0–6.6 W/m·K: Reliable heat dissipation for server modules
• Single-Component: Easy dispensing for long-term reliability
Humanoid Robotics
Stop Silent Connection Failures. 100% silicone-free pads to prevent micro-arcing and insulating silica buildup in critical joints.
• Thermal Power: 6.0–15.0 W/m·K
• Electrical Stability: No siloxane outgassing
• Mechanical Reliability: Sustained heat transfer under load
Why Our Pads Outperform Standard Gap Fillers
Our advanced polymer modification solves three critical thermal pad failures: peak-load overheating, PCB stress from hard materials, and long-term silicone bleed.
Your Device Runs 30°C Cooler. Your Design Stays Exactly the Same.
Surface Modified · More Compliant · Highly Thermal Conductive
Standard high thermal conductive pads often become too stiff, creating air gaps and higher resistance. Our surface-modified technology rebuilds pathways at the molecular level, delivering a softer, more compliant, and more conductive material simultaneously.
Junction Temp: 118°C → 88°C (–30°C)
Thermal Resistance：0.58 ℃·cm²/W → 0.49 ℃·cm²/W (15.5%)
Same Thickness, Lower Thermal Resistance.
Component Protection · Thermal Performance · Drop-In Replacement
Surface-modified architecture builds continuous phonon highways, delivering extreme thermal conductivity without the rigidity of traditional highly-filled pads.
20 W/m·K (Shore 00 40-60): Eliminates trapped air without requiring extreme >80 psi clamping force.
>60% Compression @ 40 psi: Low-stress assembly protects solder joints and prevents die cracking.
Up to 24°C Cooler: Rθ drops to 0.11 °C·cm²/W, keeping chips safely at 94°C (vs. 118°C).
Protect Your System for 8+ Years.
Thermal Safeguard · Self-Recovery · Long-Term Stability
Standard pads creep and collapse over time. hongjitc uses molecular-level modification to prevent material aging, maintaining exceptional contact and thermal stability under extreme conditions.
Zero Compression Creep: Proprietary molecular bonding ensures high resilience and prevents gap-filling failure.
Ultra-Low Oil Bleeding: <3mm oil separation diameter after extreme baking (168hrs @ 120°C).
Lifecycle Reliability: Delivers stable thermal conductivity consistently throughout the 8+ year lifespan.
Jiuju Pro-Series vs. Standard Gap Pads
Verified by third-party ASTM testing. Production sample documentation available upon request.
| Properties | Unit | JiuJu Pro-Series | Standard Gap Pad | Test Method |
|---|---|---|---|---|
| Thermal Conductivity | W/m·K | 1.2 - 30.0 | 1.2 - 10.0 | ASTM D5470 |
| Hardness | Shore 00 | 10 - 35 (Ultra Soft) | 50 - 80 | ASTM D2240 |
| Thickness Range | mm | 0.25 - 5.0 | 0.5 - 3.0 | ASTM D374 |
Certifications & Compliance
- IATF 16949: Automotive-grade quality management.
- ISO 9001 & 14001: Manufacturing and environmental excellence.
- RoHS & REACH: 100% eco-compliant for seamless global market access.
- UL Verified: Safety and flammability certified.
Engineering Support & Supply Reliability
From initial sampling to mass production, Jiuju engineers guide your entire qualification process. Our dedicated OEM capacity guarantees zero lead-time uncertainty.
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24-Hour Expert Selection: Submit your application specs (conductivity, thickness) and receive a tailored material recommendation within one business day.
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48-Hour Rapid Sampling: We ship standard samples in 48 hours and custom die-cuts in 5–8 days—full TDS and CoC documentation included.
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Scalable Supply Security: Leverage our dedicated OEM capacity to bypass spot-market volatility and ensure stable, peak-season pricing.
Customer Testimonials
Leader in polymer thermal conductive material modification technology
Must we use Non-Silicone for optical modules?
Absolutely. Standard silicone causes outgassing, leading to lens fogging and signal loss.
- Low Outgassing & Migration
- Ultimate reliability for LiDAR & Transceiver
Not sure which option applies to your assembly? Submit your specs and our engineers will
confirm the right material within 24 hours. →
Is a softer thermal pad (Shore 00 30) always better?
It depends on your design. Harder pads (Shore 60) can be ultra-thin for perfectly flat surfaces. Softer pads (Shore 30) are essential for filling irregular gaps and large tolerances.
- Custom Hardness Available
- Zero Localized Hot Spots
Not sure which option applies to your assembly? Submit your specs and our engineers will
confirm the right material within 24 hours. →
Thermal Gel or Pre-cut Pads for mass production?
Gel wins for complexity. Pads are great for simple, single components. But for complex boards with varying heights, automated gel dispensing eliminates the need for multiple pad SKUs.
- Single-Pass Automated Dispensing
- Cuts Material & Labor Costs by 20%+
Not sure which option applies to your assembly? Submit your specs and our engineers will
confirm the right material within 24 hours. →
How do you guarantee supply amid market volatility?
By eliminating supply chain risks. We protect our partners from long lead times and sudden price hikes.
- Long-Term Raw Material Contracts
- Guaranteed Capacity & Stable Pricing
Not sure which option applies to your assembly? Submit your specs and our engineers will
confirm the right material within 24 hours. →
3 Steps to Mass Production
A streamlined qualification process to accelerate your time-to-market.
Submit Specs
Share your application and gap requirements. Get an expert material recommendation within 24 hours.Test Samples
Standard samples ship in 48hrs; custom die-cuts in 5–8 days. TDS and CoC included for validation.Mass Production
Upon validation, we secure your production schedule and arrange global delivery with guaranteed capacity.
Get a Free Engineering Review in 24 Hours
Expert thermal solutions across 6 specialized industries. Submit your specs for precise material recommendations (thermal conductivity, thickness, format).
Let's talk
- Phone
- +8613656269868
- Address
- No. 1299 Chengbei Road, Yushan Town, Kunshan City, Jiangsu Province, China
