Ensured global product acceptance by meeting RoHS/REACH compliance for thermal pads; zero audit non‑conformities and faster market entry.
David MElectronics Manufacturer


Ultra-conductive soft pad maximizes cooling

Ultra-soft texture perfectly fills component gaps.

Low-bleed, electrically insulating pad boosts stability for electronics

Engineered thermal interface with instant adhesion

Lowers thermal resistance between components and heatsinks

Delivers superior heat conduction and insulation performance

For 20 years, we have been exploring thermally conductive materials.
Engineered with proprietary nano-formulations, our pads achieve ultra-high conductivity (up to 25 W/mK). This ensures rapid heat transfer and minimum thermal resistance, delivering optimal performance for IGBT and high-power modules.
Ultra-High W/mK
Rapid Dissipation
Low Impedance

Ultra-low modulus design guarantees superior "wet-out" at minimal pressure, preventing damage to fragile components during assembly. Provides reliable electrical isolation (up to 40 kV/mm Dielectric Strength), crucial for high-voltage inverter safety.
Low Stress
High Compliance
40 kV/mm Isolation

Compliant with mandatory UL 94 V-0 flame standards. Silicone-Free options prevent outgassing and contamination, ensuring long-term, stable, zero-maintenance performance in critical EV and telecom applications.
UL 94 V-0
Silicone-Free
Long-Life Stability

Trusted by Engineers: Client Success Stories
Use our thickness calculator considering:
Surface roughness (Ra value)
Compression force (typically 15- 30 psi)
7 working days for 80% of projects (die-cut tooling included)
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Looking forward to working with you in a win-win situation