Our thermal conductive potting compound is designed for efficient heat dissipation, electrical insulation, and reliable protection of electronic components. It provides high thermal conductivity and low thermal resistance, helping to improve thermal management and system stability.
Typical applications include power modules, battery packs and energy storage systems, EV electronics, LED drivers, and power supplies.
This table lists key technical parameters of our thermal conductive potting compounds, helping you select the right thermal potting material for efficient heat dissipation and reliable electronic protection.
| Model | Material Type | Mixed Viscosity (cps) | Curing Time | Hardness | Thermal Conductivity (W/m·K) | Key Features |
|---|---|---|---|---|---|---|
| jiuju10a | Silicone | 2500–4000 | RT: 2–4 h / 80°C: 30 min | 50–70A | 0.8 | Excellent anti-settling performance |
| jiuju100 | Silicone | 2500–4000 | RT: 2–4 h / 80°C: 30 min | 40–60A | 0.8 | Dielectric constant reduced by 10–20% compared to standard grades |
| jiuju101 | Silicone | 4000–5500 | RT: 2–4 h / 80°C: 30 min | 20–30A | 1.5 | Excellent anti-settling performance |
| jiuju100a | Silicone | 4000–6000 | RT: 2–4 h / 80°C: 30 min | 20–30A | 2 | Low viscosity, good flowability |
| jiuju100b | Silicone | 8000–12000 | RT: 2–4 h / 80°C: 30 min | 10–30A | 3 | Good flowability |
| jiuju110 | Silicone | 20000–30000 | RT: 2–5 h / 80°C: 30 min | 10–30A | 4 | High thermal conductivity |
| jiuju110a | Epoxy | 1500–3000 | 80°C: 2 h | 80–90D | 1 | Excellent high-temperature stability |
| jiuju110b | Polyurethane | 2000–3000 | RT: 2–4 h | 60–80D | 1.5 | Good adhesion, high strength |
| jiuju140 | Silicone | 2000–3000 | RT: 2–4 h | 40–60A | 1 | Good adhesion, low odor |
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