
Epoxy Potting Compound
High structural rigidity and component lock-in. Superior moisture & chemical resistance for harsh environment protection.

Safeguard your electronics from moisture, vibration, and shock. Our UL94 V-0 certified compounds offer superior thermal conductivity (up to 3.0 W/mK) and environmental protection. Request a free sample kit.

Tested for reliable thermal and mechanical performance.
Our thermal potting compounds help you solve heat dissipation and protection challenges in sealed and high-power electronic systems.
You keep critical components cool, even in enclosed or high-power applications.
You shield your electronics from moisture, vibration, and harsh environments.
You get stable thermal and mechanical properties throughout your product’s lifetime.
Ready when you need it. You get secure storage and efficient delivery to keep your supply chain moving.











We help you tackle thermal management challenges in high-power and harsh environment applications with reliable potting solutions.
Expert R&D & Manufacturing
Reliable Supply & Quality
Flexible Customization & Fast Support

Discover what our clients have to say
Potting involves filling an entire enclosure for maximum protection against environments. Encapsulation is a protective coating for components, offering a lighter level of protection.
Choose epoxy for hard, protective shells, silicone for flexibility and high heat, and urethane for vibration resistance and good adhesion.
Yes. Many of our compounds are UL 94 V-0 recognized and meet TUV standards for flame retardancy and electrical insulation.
Cure times range from 30 minutes for fast-processing grades to 24 hours for deep section pours. Heat can accelerate curing.